Engineering simulation leader Ansys is harnessing NVIDIA's cutting-edge technology to tackle the complexities of three-dimensional integrated circuit (3D-IC) design, as revealed at this week's Design Automation Conference.
3D-ICs, which stack chip components vertically, offer enhanced performance without increasing power consumption. However, their dense structure presents significant challenges in managing electromagnetic and thermal stresses. To address these issues, Ansys is employing NVIDIA Omniverse and Modulus to create advanced 3D multiphysics visualisations crucial for design and diagnostics.
NVIDIA Omniverse, a platform integrating Universal Scene Description and RTX rendering technologies, enables Ansys to provide users with comprehensive 3D visualisations of simulation results. Engineers can now evaluate electromagnetic fields and temperature variations across chips, optimising designs for speed, functionality, and reliability.
Ansys Icepak, running on the NVIDIA Omniverse platform, allows engineers to simulate temperatures across a chip according to different power profiles and floor plans. This capability is vital for improving both chip design and auxiliary cooling systems.
To further accelerate simulation workflows, Ansys researchers are exploring AI-based surrogate models using NVIDIA Modulus, an open-source AI framework. Leveraging Modulus's Fourier neural operator architecture, Ansys has developed a model that swiftly predicts temperature profiles based on power profiles and system parameters.
This AI surrogate model offers near real-time results at significantly reduced computational costs, allowing users to explore a wider design space for new chips. This approach fosters innovation and enhances product safety in the development process.
Following a successful proof of concept, Ansys plans to integrate these AI surrogate models into its next-generation RedHawk-SC platform. The company is also exploring ways to enhance model generality and accuracy through in-situ fine-tuning, enabling users to refine models with their own data.
As the semiconductor industry continues to push the boundaries of chip design, collaborations like that between Ansys and NVIDIA are proving instrumental in overcoming the challenges of 3D-IC development, paving the way for more powerful and efficient electronic devices.