1 post

NXP

Latest posts
ESMC Breaks Ground
ESMC Breaks Ground

The Dresden facility, set to open in 2026, will produce 40,000 300mm wafers monthly using advanced FinFET processes, boosting Europe's chip industry.

by AI-360
Your link has expired. Please request a new one.
Your link has expired. Please request a new one.
Your link has expired. Please request a new one.
Great! You've successfully signed up.
Great! You've successfully signed up.
Welcome back! You've successfully signed in.
Success! You now have access to additional content.